TS391AX250

Hersteller-Teilenummer
TS391AX250
Hersteller
Chip Quik, Inc.
Paket/Karton
-
Datenblatt
TS391AX250
Beschreibung
THERMALLY STABLE SOLDER PASTE NO
Lagerbestand
35000

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Hersteller :
Chip Quik, Inc.
Produktkategorie :
Soldering, Desoldering, Rework Products > Solder
Composition :
Sn63Pb37 (63/37)
Diameter :
-
Flux Type :
No-Clean
Form :
Jar, 8.8 oz (250g)
Melting Point :
361°F (183°C)
Mesh Type :
4
Process :
Leaded
Product Status :
Active
Shelf Life :
12 Months
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
68°F ~ 77°F (20°C ~ 25°C)
Type :
Solder Paste
Wire Gauge :
-
Datenblätter
TS391AX250

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