HONGLIXIN TECHNOLOGY ELECTRON LIMITED
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  6. 16-81100-310C
16-81100-310C

16-81100-310C

Hersteller-Teilenummer
16-81100-310C
Hersteller
Aries Electronics, Inc.
Paket/Karton
-
Datenblatt
16-81100-310C
Beschreibung
CONN IC DIP SOCKET 16POS GOLD
Lagerbestand
35000

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Hersteller :
Aries Electronics, Inc.
Produktkategorie :
Sockets for ICs, Transistors > IC Sockets
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Closed Frame, Elevated
Housing Material :
Polyamide (PA46), Nylon 4/6, Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
16 (2 x 8)
Operating Temperature :
-55°C ~ 105°C
Product Status :
Active
Termination :
Solder
Datenblätter
16-81100-310C

Herstellerbezogene Produkte

  • 默认图片
    05-004-171HT
    Aries Electronics, Inc.
    CABLE 5POS .100 JUMPER 4 INCH
  • 默认图片
    04-002.5-171
    Aries Electronics, Inc.
    CABLE 4POS .100 JUMPER 2.5 INCH
  • 默认图片
    04-002-171
    Aries Electronics, Inc.
    CABLE 4POS .100 JUMPER 2 INCH
  • 默认图片
    04-003-171
    Aries Electronics, Inc.
    CABLE 4POS .100 JUMPER 3 INCH
  • 默认图片
    04-002.5-172
    Aries Electronics, Inc.
    CABLE 4POS .100 JUMPER 2.5 INCH

Katalogbezogene Produkte

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