BU200Z-178-HT

Hersteller-Teilenummer
BU200Z-178-HT
Hersteller
On-Shore Technology, Inc.
Paket/Karton
-
Datenblatt
BU200Z-178-HT
Beschreibung
CONN IC DIP SOCKET 20POS GOLD
Lagerbestand
35000

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Hersteller :
On-Shore Technology, Inc.
Produktkategorie :
Sockets for ICs, Transistors > IC Sockets
Contact Finish - Mating :
Gold
Contact Finish - Post :
Copper
Contact Finish Thickness - Mating :
78.7µin (2.00µm)
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
20 (2 x 10)
Operating Temperature :
-55°C ~ 125°C
Product Status :
Obsolete
Termination :
Solder
Datenblätter
BU200Z-178-HT

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