TC3-1G
- Hersteller-Teilenummer
- TC3-1G
- Hersteller
- Chip Quik, Inc.
- Paket/Karton
- -
- Datenblatt
- TC3-1G
- Beschreibung
- HEAT SINK THERMAL COMPOUND
- Lagerbestand
- 60
Angebot anfordern (RFQ)
- * Kontaktname:
- * Unternehmen:
- * E-Mail:
- * Telefon:
- * Kommentar:
- * Captcha:
-
- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Fans, Thermal Management > Thermal - Adhesives, Epoxies, Greases, Pastes
- Color :
- Gray
- Features :
- -
- Product Status :
- Active
- Shelf Life :
- 60 Months
- Size / Dimension :
- 1 gram Syringe
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Thermal Conductivity :
- 8.50W/m-K
- Type :
- Silicone Compound
- Usable Temperature Range :
- -40°F ~ 302°F (-40°C ~ 150°C)
- Datenblätter
- TC3-1G
Herstellerbezogene Produkte
Katalogbezogene Produkte
Ähnliche Produkte
| Teil | Hersteller | Lagerbestand | Beschreibung |
|---|---|---|---|
| TC3-10G | Chip Quik, Inc. | 76 | HEAT SINK THERMAL COMPOUND |
| TC3-1T+ | Mini-Circuits | 16,614 | 1:3 CORE & WIRE TRANSFORMER, 5 - |
| TC3-1TG2+ | Mini-Circuits | 35,000 | 1:3 CORE & WIRE TRANSFORMER, 5 - |
| TC3-1TX+ | Mini-Circuits | 35,000 | 1:3 CORE & WIRE TRANSFORMER, 5 - |
| TC3-3.5G | Chip Quik, Inc. | 35,000 | HEAT SINK THERMAL COMPOUND |
| TC3-5-C100 | Panduit Corporation | 35,000 | CBL CLIP C-TYPE BLACK FASTENER |
