HSB02-101007
- Hersteller-Teilenummer
- HSB02-101007
- Hersteller
- CUI Devices
- Paket/Karton
- -
- Datenblatt
- HSB02-101007
- Beschreibung
- HEAT SINK, BGA, 10 X 10 X 7 MM
- Lagerbestand
- 3205
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- Hersteller :
- CUI Devices
- Produktkategorie :
- Fans, Thermal Management > Thermal - Heat Sinks
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Power Dissipation @ Temperature Rise :
- 2.0W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 16.50°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 37.90°C/W
- Type :
- Top Mount
- Datenblätter
- HSB02-101007
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