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HSB11-252518

ATS-PCB1074

Advanced Thermal Solutions, Inc.

HEATSINK TO-263 COPPER
ATS-CPX025025015-166-C1-R0

Advanced Thermal Solutions, Inc.

HEATSINK 25X25X15MM R-TAB CP
ATS-CPX025025015-138-C2-R0

Advanced Thermal Solutions, Inc.

HEATSINK 25X25X15MM L-TAB CP
ATS-CPX050050025-124-C2-R0

Advanced Thermal Solutions, Inc.

HEATSINK 50X50X25MM XCUT CP
ATS-TI10P-521-C1-R1

Advanced Thermal Solutions, Inc.

HEAT SINK FOR TI MOD #TPA3130D

Teil	Hersteller	Lagerbestand	Beschreibung
HSB10-232306	CUI Devices	1,287	HEAT SINK, BGA, 23 X 23 X 6 MM
HSB12-272706	CUI Devices	1,713	HEAT SINK, BGA, 27 X 27 X 6 MM
HSB123JTR-E	Intersil (Renesas Electronics Corporation)	69,000	DIODE FOR HIGH SPEED SWITCHING
HSB123TL-E	Intersil (Renesas Electronics Corporation)	12,000	DIODE FOR HIGH SPEED SWITCHING
HSB123TR-E	Intersil (Renesas Electronics Corporation)	62,700	DIODE FOR HIGH SPEED SWITCHING
HSB124S-JTL-E	Intersil (Renesas Electronics Corporation)	63,000	DIODE FOR HIGH SPEED SWITCHING
HSB124STL-E	Intersil (Renesas Electronics Corporation)	68,750	DIODE FOR SWITCHING
HSB13-303014	CUI Devices	524	HEAT SINK, BGA, 30.7 X 30.7 X 14
HSB14-353518	CUI Devices	700	HEAT SINK, BGA, 35 X 35 X 18 MM
HSB15-404010	CUI Devices	35,000	HEAT SINK, BGA, 40 X 40 X 10 MM
HSB16-404018	CUI Devices	1,250	HEAT SINK, BGA, 40 X 40 X 18 MM
HSB17-404025	CUI Devices	35,000	HEAT SINK, BGA, 40 X 40 X 25 MM
HSB18-232310	CUI Devices	5,589	HEAT SINK, BGA, 23 X 23 X 10 MM
HSB19-272718	CUI Devices	239	HEAT SINK, BGA, 27 X 27 X 18 MM