BDN10-3CB/A01

Hersteller-Teilenummer
BDN10-3CB/A01
Hersteller
CTS Corporation
Paket/Karton
-
Datenblatt
BDN10-3CB/A01
Beschreibung
HEATSINK CPU W/ADHESIVE 1.01"SQ
Lagerbestand
35000

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Hersteller :
CTS Corporation
Produktkategorie :
Fans, Thermal Management > Thermal - Heat Sinks
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
8.00°C/W @ 400 LFM
Thermal Resistance @ Natural :
26.40°C/W
Type :
Top Mount
Datenblätter
BDN10-3CB/A01

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