TH997-288-192-3.0

Hersteller-Teilenummer
TH997-288-192-3.0
Hersteller
Penchem Technologies Sdn Bhd
Paket/Karton
-
Datenblatt
TH997-288-192-3.0
Beschreibung
SOFT SILICONE THERMAL PAD
Lagerbestand
14

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Hersteller :
Penchem Technologies Sdn Bhd
Produktkategorie :
Fans, Thermal Management > Thermal - Pads, Sheets
Adhesive :
Tacky - Both Sides
Backing, Carrier :
-
Color :
Blue
Material :
Silicone
Outline :
288.00mm x 192.00mm
Product Status :
Active
Shape :
Rectangular
Thermal Conductivity :
2.4W/m-K
Thermal Resistivity :
-
Type :
Gap Filler Pad, Sheet
Usage :
Thermally Conductive
Datenblätter
TH997-288-192-3.0

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