BU180Z-178-HT
- Référence fabricant #
- BU180Z-178-HT
- Fabricant
- On-Shore Technology, Inc.
- Colis/Boîte
- -
- Fiche technique
- BU180Z-178-HT
- Description
- CONN IC DIP SOCKET 18POS GOLD
- Stock
- 35000
Demander un devis (RFQ)
- * Nom du contact:
- * Société:
- * Courriel:
- * Téléphone:
- * Commentaire:
- * Captcha:
-
- Fabricant :
- On-Shore Technology, Inc.
- Catégorie de produit :
- Sockets for ICs, Transistors > IC Sockets
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Copper
- Contact Finish Thickness - Mating :
- 78.7µin (2.00µm)
- Contact Finish Thickness - Post :
- Flash
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Open Frame
- Housing Material :
- Polybutylene Terephthalate (PBT), Glass Filled
- Mounting Type :
- Surface Mount
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Operating Temperature :
- -55°C ~ 125°C
- Product Status :
- Obsolete
- Termination :
- Solder
- Fiches techniques
- BU180Z-178-HT
Produits liés au fabricant
Produits liés au catalogue
Produits associés
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| BU18TD2WNVX-TL | ROHM Semiconductor | 2,871 | IC REG LIN 1.8V 200MA 4SSON |
