840-AG11D
- Référence fabricant #
- 840-AG11D
- Fabricant
- TE Connectivity AMP Connectors
- Colis/Boîte
- -
- Fiche technique
- 840-AG11D
- Description
- CONN IC DIP SOCKET 40POS GOLD
- Stock
- 35000
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- Fabricant :
- TE Connectivity AMP Connectors
- Catégorie de produit :
- Sockets for ICs, Transistors > IC Sockets
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 25.0µin (0.63µm)
- Contact Finish Thickness - Post :
- -
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 40 (2 x 20)
- Operating Temperature :
- -55°C ~ 105°C
- Product Status :
- Obsolete
- Termination :
- Solder
- Fiches techniques
- 840-AG11D
Produits liés au fabricant
Produits liés au catalogue
Produits associés
| Partie | Fabricant | Stock | Description |
|---|---|---|---|
| 840-004 | Altech Corporation | 20 | 254MM SQ 5P TERM |
| 840-006 | Altech Corporation | 35,000 | 6MM SQ 5P TERM |
| 840-010 | Altech Corporation | 35,000 | 10MM SQ 5P TERM |
| 840-016 | Altech Corporation | 35,000 | 1625MM SQ 5P TERM |
| 840-035 | Altech Corporation | 35,000 | 3525MM SQ 5P TERM |
| 840-07121300000 | ddm hopt+schuler | 10 | MANUAL LANDED CHIP CARD W/FLEX |
| 840-0LK83303001 | ddm hopt+schuler | 24 | ROBUST POS SMART CARD CONNECTOR |
| 840-AG10D | TE Connectivity AMP Connectors | 35,000 | CONN IC DIP SOCKET 40POS GOLD |
| 840-AG11D-ES | TE Connectivity AMP Connectors | 35,000 | CONN IC DIP SOCKET 40POS GOLD |
| 840-AG11D-ESL-LF | TE Connectivity AMP Connectors | 1 | CONN IC DIP SOCKET 40POS GOLD |
| 840-FMB31KE0000 | ddm hopt+schuler | 20 | SLIM POS SMART CARD CONNECTOR |
