BDN11-3CB/A01
- Référence fabricant #
- BDN11-3CB/A01
- Fabricant
- CTS Corporation
- Colis/Boîte
- -
- Fiche technique
- BDN11-3CB/A01
- Description
- HEATSINK CPU W/ADHESIVE 1.11"SQ
- Stock
- 3310
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- Fabricant :
- CTS Corporation
- Catégorie de produit :
- Fans, Thermal Management > Thermal - Heat Sinks
- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Power Dissipation @ Temperature Rise :
- -
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 7.20°C/W @ 400 LFM
- Thermal Resistance @ Natural :
- 20.90°C/W
- Type :
- Top Mount
- Fiches techniques
- BDN11-3CB/A01
Produits liés au fabricant
Produits liés au catalogue
Produits associés
| Partie | Fabricant | Stock | Description |
|---|---|---|---|
| BDN10-3CB/A01 | CTS Corporation | 35,000 | HEATSINK CPU W/ADHESIVE 1.01"SQ |
| BDN10-5CB/A01 | CTS Corporation | 35,000 | HEATSINK CPU W/ADHESIVE 1.01"SQ |
| BDN12-3CB/A01 | CTS Corporation | 35,000 | HEATSINK CPU W/ADHESIVE 1.21"SQ |
| BDN12-5CB/A01 | CTS Corporation | 427 | HEATSINK CPU W/ADHESIVE 1.21"SQ |
| BDN13-3CB/A01 | CTS Corporation | 35,000 | HEATSINK CPU W/ADHESIVE 1.31"SQ |
| BDN14-3CB/A01 | CTS Corporation | 1,304 | HEATSINK CPU W/ADHESIVE 1.41"SQ |
| BDN15-3CB/A01 | CTS Corporation | 35,000 | HEATSINK CPU W/ADHESIVE 1.51"SQ |
| BDN16-3CB/A01 | CTS Corporation | 35,000 | HEATSINK CPU W/ADHESIVE 1.61"SQ |
| BDN17-3CB/A01 | CTS Corporation | 35,000 | HEATSINK CPU W/ADHESIVE 1.71"SQ |
| BDN18-3CB/A01 | CTS Corporation | 731 | HEATSINK CPU W/ADHESIVE 1.81"SQ |
| BDN18-6CB/A01 | CTS Corporation | 941 | HEATSINK CPU W/ADHESIVE 1.81"SQ |
