| HSB10-232306 | 
                                        CUI Devices | 
                                        1,287 | 
                                        HEAT SINK, BGA, 23 X 23 X 6 MM | 
                                    
                                                                    
                                        | HSB11-252518 | 
                                        CUI Devices | 
                                        1,433 | 
                                        HEAT SINK, BGA, 25 X 25 X 18 MM | 
                                    
                                                                    
                                        | HSB12-272706 | 
                                        CUI Devices | 
                                        1,713 | 
                                        HEAT SINK, BGA, 27 X 27 X 6 MM | 
                                    
                                                                    
                                        | HSB123JTR-E | 
                                        Intersil (Renesas Electronics Corporation) | 
                                        69,000 | 
                                        DIODE FOR HIGH SPEED SWITCHING | 
                                    
                                                                    
                                        | HSB123TL-E | 
                                        Intersil (Renesas Electronics Corporation) | 
                                        12,000 | 
                                        DIODE FOR HIGH SPEED SWITCHING | 
                                    
                                                                    
                                        | HSB123TR-E | 
                                        Intersil (Renesas Electronics Corporation) | 
                                        62,700 | 
                                        DIODE FOR HIGH SPEED SWITCHING | 
                                    
                                                                    
                                        | HSB124S-JTL-E | 
                                        Intersil (Renesas Electronics Corporation) | 
                                        63,000 | 
                                        DIODE FOR HIGH SPEED SWITCHING | 
                                    
                                                                    
                                        | HSB13-303014 | 
                                        CUI Devices | 
                                        524 | 
                                        HEAT SINK, BGA, 30.7 X 30.7 X 14 | 
                                    
                                                                    
                                        | HSB14-353518 | 
                                        CUI Devices | 
                                        700 | 
                                        HEAT SINK, BGA, 35 X 35 X 18 MM | 
                                    
                                                                    
                                        | HSB15-404010 | 
                                        CUI Devices | 
                                        35,000 | 
                                        HEAT SINK, BGA, 40 X 40 X 10 MM | 
                                    
                                                                    
                                        | HSB16-404018 | 
                                        CUI Devices | 
                                        1,250 | 
                                        HEAT SINK, BGA, 40 X 40 X 18 MM | 
                                    
                                                                    
                                        | HSB17-404025 | 
                                        CUI Devices | 
                                        35,000 | 
                                        HEAT SINK, BGA, 40 X 40 X 25 MM | 
                                    
                                                                    
                                        | HSB18-232310 | 
                                        CUI Devices | 
                                        5,589 | 
                                        HEAT SINK, BGA, 23 X 23 X 10 MM | 
                                    
                                                                    
                                        | HSB19-272718 | 
                                        CUI Devices | 
                                        239 | 
                                        HEAT SINK, BGA, 27 X 27 X 18 MM |