HSB04-171706
- Mfr.Part #
- HSB04-171706
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- HSB04-171706
- Description
- HEAT SINK, BGA, 17 X 17 X 6 MM
- Stock
- 35000
Request A Quote(RFQ)
- * Contact Name:
- * Company:
- * E-Mail:
- * Whatsapp:
- * Comment:
- * Captcha:
-
- Manufacturer :
- CUI Devices
- Product Category :
- Fans, Thermal Management > Thermal - Heat Sinks
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Power Dissipation @ Temperature Rise :
- 2.5W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 13.10°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 29.73°C/W
- Type :
- Top Mount
- Datasheets
- HSB04-171706
Manufacturer related products
Catalog related products
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| HSB01-080808 | CUI Devices | 35,000 | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM |
| HSB0104YP-NTR-E | Intersil (Renesas Electronics Corporation) | 6,000 | SCHOTTKY BARRIER DIODE |
| HSB0104YPTL-E | Intersil (Renesas Electronics Corporation) | 111,092 | SCHOTTKY BARRIER DIODE |
| HSB0104YPTR-E | Intersil (Renesas Electronics Corporation) | 2,571 | SCHOTTKY BARRIER DIODE |
| HSB02-101007 | CUI Devices | 3,205 | HEAT SINK, BGA, 10 X 10 X 7 MM |
| HSB03-121218 | CUI Devices | 1,689 | HEAT SINK, BGA, 12 X 12 X 18 MM |
| HSB03-141406 | CUI Devices | 3,326 | HEAT SINK, BGA, 14 X 14 X 6 MM |
| HSB05-171711 | CUI Devices | 35,000 | HEAT SINK, BGA, 17 X 17 X 11.5 M |
| HSB06-181810 | CUI Devices | 780 | HEAT SINK, BGA, 18 X 18 X 10 MM |
| HSB07-202009 | CUI Devices | 35,000 | HEAT SINK, BGA, 20 X 20 X 9 MM |
| HSB08-212106 | CUI Devices | 35,000 | HEAT SINK, BGA, 21 X 21 X 6 MM |
| HSB09-212115 | CUI Devices | 35,000 | HEAT SINK, BGA, 21 X 21 X 15 MM |
