HSB124S-JTL-E
- Производитель-деталь №
- HSB124S-JTL-E
- Производитель
- Intersil (Renesas Electronics Corporation)
- Упаковка/футляр
- -
- Техническое описание
- HSB124S-JTL-E
- Описание
- DIODE FOR HIGH SPEED SWITCHING
- lang_0071
- 63000
Запросить предложение (ЗКП)
- * lang_0862:
- * Компания:
- * Электронная почта:
- * Телефон:
- * Комментарий:
- * Проверка кода:
-
- lang_0872 :
- Intersil (Renesas Electronics Corporation)
- Категория товара :
- Discrete Semiconductor Products > Diodes - Rectifiers - Single
- Capacitance @ Vr, F :
- -
- Current - Average Rectified (Io) :
- -
- Current - Reverse Leakage @ Vr :
- -
- Diode Type :
- -
- Mounting Type :
- -
- Operating Temperature - Junction :
- -
- Package / Case :
- -
- Product Status :
- Active
- Reverse Recovery Time (trr) :
- -
- Speed :
- -
- Supplier Device Package :
- -
- Voltage - DC Reverse (Vr) (Max) :
- -
- Voltage - Forward (Vf) (Max) @ If :
- -
- lang_0258
- HSB124S-JTL-E
Продукты, связанные с производителем
Продукты, связанные с каталогом
Сопутствующие товары
| Деталь | Производитель | Склад | Описание |
|---|---|---|---|
| HSB10-232306 | CUI Devices | 1,287 | HEAT SINK, BGA, 23 X 23 X 6 MM |
| HSB11-252518 | CUI Devices | 1,433 | HEAT SINK, BGA, 25 X 25 X 18 MM |
| HSB12-272706 | CUI Devices | 1,713 | HEAT SINK, BGA, 27 X 27 X 6 MM |
| HSB123JTR-E | Intersil (Renesas Electronics Corporation) | 69,000 | DIODE FOR HIGH SPEED SWITCHING |
| HSB123TL-E | Intersil (Renesas Electronics Corporation) | 12,000 | DIODE FOR HIGH SPEED SWITCHING |
| HSB123TR-E | Intersil (Renesas Electronics Corporation) | 62,700 | DIODE FOR HIGH SPEED SWITCHING |
| HSB124STL-E | Intersil (Renesas Electronics Corporation) | 68,750 | DIODE FOR SWITCHING |
| HSB13-303014 | CUI Devices | 524 | HEAT SINK, BGA, 30.7 X 30.7 X 14 |
| HSB14-353518 | CUI Devices | 700 | HEAT SINK, BGA, 35 X 35 X 18 MM |
| HSB15-404010 | CUI Devices | 35,000 | HEAT SINK, BGA, 40 X 40 X 10 MM |
| HSB16-404018 | CUI Devices | 1,250 | HEAT SINK, BGA, 40 X 40 X 18 MM |
| HSB17-404025 | CUI Devices | 35,000 | HEAT SINK, BGA, 40 X 40 X 25 MM |
| HSB18-232310 | CUI Devices | 5,589 | HEAT SINK, BGA, 23 X 23 X 10 MM |
| HSB19-272718 | CUI Devices | 239 | HEAT SINK, BGA, 27 X 27 X 18 MM |
