HONGLIXIN TECHNOLOGY ELECTRON LIMITED
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  3. Fans, Thermal Management
  4. Thermal - Heat Sinks
  5. HSE-B18381-035H
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    HSE-B18381-035H

    メーカー部品番号
    HSE-B18381-035H
    メーカー
    CUI Devices
    パッケージ/ケース
    -
    データシート
    HSE-B18381-035H
    説明
    HEAT SINK, EXTRUSION, TO-218, 38
    在庫
    35000

    見積依頼(RFQ)

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    メーカー :
    CUI Devices
    製品カテゴリ :
    Fans, Thermal Management > Thermal - Heat Sinks
    Attachment Method :
    Bolt On and PC Pin
    Diameter :
    -
    Material :
    Aluminum Alloy
    Material Finish :
    Black Anodized
    Package Cooled :
    TO-218
    Power Dissipation @ Temperature Rise :
    12.0W @ 75°C
    Product Status :
    Active
    Shape :
    Rectangular, Angled Fins
    Thermal Resistance @ Forced Air Flow :
    3.52°C/W @ 200 LFM
    Thermal Resistance @ Natural :
    6.25°C/W
    Type :
    Board Level, Vertical
    データシート
    HSE-B18381-035H

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    パート メーカー 在庫 説明
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    HSE-B18317-035H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 31
    HSE-B18317-035H-01 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 31
    HSE-B18318-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION,TO-218, 31.
    HSE-B18381-035H-02 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
    HSE-B18381-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
    HSE-B18381-060H-W CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 38
    HSE-B18508-035H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 50
    HSE-B18508-035H-03 CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 50
    HSE-B18508-0396H CUI Devices 35,000 HEAT SINK, EXTRUSION, TO-218, 50
    連絡してください
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