| HSB01-080808 | CUI Devices | 35,000 | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM | 
                                                                    
                                        | HSB0104YP-NTR-E | Intersil (Renesas Electronics Corporation) | 6,000 | SCHOTTKY BARRIER DIODE | 
                                                                    
                                        | HSB0104YPTL-E | Intersil (Renesas Electronics Corporation) | 111,092 | SCHOTTKY BARRIER DIODE | 
                                                                    
                                        | HSB0104YPTR-E | Intersil (Renesas Electronics Corporation) | 2,571 | SCHOTTKY BARRIER DIODE | 
                                                                    
                                        | HSB02-101007 | CUI Devices | 3,205 | HEAT SINK, BGA, 10 X 10 X 7 MM | 
                                                                    
                                        | HSB03-141406 | CUI Devices | 3,326 | HEAT SINK, BGA, 14 X 14 X 6 MM | 
                                                                    
                                        | HSB04-171706 | CUI Devices | 35,000 | HEAT SINK, BGA, 17 X 17 X 6 MM | 
                                                                    
                                        | HSB05-171711 | CUI Devices | 35,000 | HEAT SINK, BGA, 17 X 17 X 11.5 M | 
                                                                    
                                        | HSB06-181810 | CUI Devices | 780 | HEAT SINK, BGA, 18 X 18 X 10 MM | 
                                                                    
                                        | HSB07-202009 | CUI Devices | 35,000 | HEAT SINK, BGA, 20 X 20 X 9 MM | 
                                                                    
                                        | HSB08-212106 | CUI Devices | 35,000 | HEAT SINK, BGA, 21 X 21 X 6 MM | 
                                                                    
                                        | HSB09-212115 | CUI Devices | 35,000 | HEAT SINK, BGA, 21 X 21 X 15 MM |